VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...
SAN JOSE, Calif. — Following possible shortages and supply-chain disruptions in the market, Japan's Shin-Etsu Chemical Co. Ltd. (SEH) has recently increased the prices for its epoxy molding ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
Panasonic Corporation announced today that it has commercialized the first sulfur-free *2 encapsulation molding compound (EMC) for copper wire bonding in the industry *1, and will start mass ...
Master Bond Inc offers the widest selection of compounds and the technical expertise to help you meet your potting and encapsulation needs. From relays, connectors and power supplies to surge ...
SAN DIEGO--(BUSINESS WIRE)--Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was ...
“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...
Thermoset molding compounds are fundamental to manufacturing components exposed to thermal, chemical, or mechanical stress, as they retain their strength and integrity even under challenging ...
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