TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that the company’s research papers have been accepted for presentation at IEEE International Electron ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

CEO Andy Hsu will introduce NEO Semiconductor's 3D X-AI™, a game-changing 3D memory with AI processing that combines data storage and data processing in a single chip, accelerating neural performance ...

Showcase the technology of highly stackable oxide-semiconductor channel transistors Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable ...

NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

Forward-looking: The AI boom is in full swing, and chip manufacturers are bringing new, advanced memory technologies to the table. Next-generation High Bandwidth Memory (HBM) is poised to deliver ...

One of the most fundamental problems in modern silicon is known as the processor-memory performance gap. The term, which has been used for decades, refers to the well-known tendency for CPUs to ...

Speaking at the American Chemical Society, James Tour of Rice University has apparently demonstrated non-volatile 3D memory chips that are transparent, flexible enough to be folded like paper, and ...

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...